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技術資訊
DSM帝斯曼NeoRez R-985/R-986聚氨酯分散體
產品說明:用于金屬面漆,罩光清漆,手套涂料,皮革涂料;用作含PVC或不含的地板面漆;與丙烯酸乳液一起用于塑膠涂料。
發布時間:
2021-01-06
Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards
Unique Technology Helps Create Smaller, More Sustainable, Less Expensive Consumer Electronics.
2022-03-07
Copper Gleam? HV-101 & HV-606 Electrolytic Copper
Copper Gleam??HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.
Copper Gleam? HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company
The Copper Gleam? HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Circuposit? 3000-1 from Dupont Dow Rhom Hass Company
Circuposit??3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
BondFilm工藝介紹
通常來說,BondFilm工藝會將銅微蝕刻至1.2 到1.5 μm的厚度,同時將銅表面(200 - 300 A)轉化成期望的有機-金屬結構。通過這個工藝后,可見的結果便是形成一個棕色的均勻鍍層。雖然銅的蝕刻會隨著浸置時間而不斷進行,但是實際上BondFilm粘附層的生長是受自我限制的,在該層的形成和溶解達到平衡后,就會達到了一個最大厚度。
2021-10-05
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